MENU
China Chamber of Commerce

Overseas Economic and Trade Zones

Confirm
Cancel
x

Ok
x
Sign into your account
Member ID or Email
Join Free
Pure Copper Sputtering Target 4N 5N Planar Target for Semiconductor and Decorative Coating
Pure Copper Sputtering Target 4N 5N Planar Target for Semiconductor and Decorative Coating

Pure Copper Sputtering Target 4N 5N Planar Target for Semiconductor and Decorative Coating

Manufacturer

  • Product Details
  • Company Profile

High Purity Copper Sputtering Target Planar Target

Copper sputtering target has the same properties as metal copper (Cu) .Copper is a chemical element with the symbol Cu (from Latin: cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed pure copper is pinkish-orange. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys. Copper Sputtering Target is produced by melting technology, it’s widely applied for semiconductor, decorative coating and advanced packing field.

We can produce copper sputtering target with purity of 99.9%~99.9999%, and the lowest oxygen content can be <1ppm, it is mainly used for display screen and touch screen wiring and protective film, solar light absorbing layer, semiconductor wiring, etc. We not only produce planar copper sputtering targets (maximum G8.5 generation), but also copper rotary targets, which are mainly used for the touch screen industry. Since it is difficult to break the grain, we can only process with very large deformation and control the growth of twins to achieve a fine and uniform microstructure, which ensure a lower erosion rate and sensitivity of the formation of particles during sputtering.


Our copper sputtering target is high purity, the most important benefit is that the films will possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Following is a typically Certificate of analysis for 4N copper sputtering target.

Analytical Methods:
1. Metallic elements were analyzed by GDMS and ICP-OES.
2. Gas elements were analyzed by LECO.


Cu sputtering target

Send Inquiry to This Supplier

  • Title
  • From*
  • toAlice
  • Message*
  • Minimum Order Quantity*
  • Unit
  • Verification Code*